Semiconductor Packaging Materials Interaction and Reliability
Material type:
ArticlePublication details: Taylor & Francis CRC Press [Imprint] 2012Description: 1 electronic resource (216 p.)Content type: - text
- computer
- online resource
- Technology, Engineering, Agriculture, Industrial processes
- Mechanical engineering and materials
- Materials science
- Electronics and communications engineering
- Electronics engineering
- Electronics: circuits and components
- Circuits and Devices
- ENG
- ElectricalEngineering
- Electromagnetics and Microwaves
- Electronic Packaging
- MATERIALS
- SCI-TECH
- STM
- array
- ball
- compound
- frame
- grid
- lead
- level
- molding
- package
- wafer
Open Access Unrestricted online access star
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
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Creative Commons Licence http://creativecommons.org/licenses/by-nc-nd/4.0 by-nc-nd cc
eng
Freely available e-book